Method for forming a barrier layer

ABSTRACT

Methods and devices are disclosed utilizing a silicon-containing barrier layer. A method of forming a barrier layer on a semiconductor device is disclosed. A semiconductor device is provided. A silicon-containing material is deposited on the semiconductor device. The silicon-containing material is processed in a reactive ambient. The barrier layer can be made primarily oxide, primarily nitride or both by the reactive ambient selected. A semiconductor device is disclosed. The semiconductor device includes a substrate, a gate oxide, a silicon-containing barrier layer and a gate electrode. The gate oxide is formed over the substrate. The silicon-containing barrier layer is formed over the gate oxide by causing silicon atoms of a precursor layer react with a reactive agent. The gate electrode is formed over the silicon-containing barrier layer. Other embodiments utilizing a barrier layer are disclosed.

CROSS-REFERENCES TO RELATED APPLICATIONS

[0001] This application is related to commonly assigned U.S. patentapplication Ser. Nos.: ______, (Attorney Docket No. MIO0060PA),METHODFOR FORMING A DIELECTRIC LAYER TO INCREASE SEMICONDUCTOR DEVICEPERFORMANCE, filed ______, by Powell et al. and ______, (Attorney DocketNo. MIO0061), METHOD FOR FORMING A DIELECTRIC LAYER AT A LOWTEMPERATURE, filed ______, by Mercaldi et al., the disclosures of whichare incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The present invention relates to the field of semiconductors and,more particularly, to an improved barrier layer for increasingsemiconductor performance.

BACKGROUND OF THE INVENTION

[0003] There is a constant demand for semiconductor devices of a reducedsize. The performance of semiconductor capacitors, transistors,electrode layers and the like in semiconductor devices becomes morecritical as device size decreases. Accordingly, processes that result inincreased device

[0004] performance are critical to improved semiconductor devicefabrication. For example, capacitor and transistor performance can beimproved by limiting diffusion of oxygen to transistor active areas orcapacitor electrodes.

[0005] Barrier layers are generally used in circuitry and semiconductordevices to enhance performance by reducing diffusion, migration andreaction. Accordingly, there is a continuing need for improved barrierlayer technology directed at improving semiconductor device performance.

SUMMARY OF THE INVENTION

[0006] This need is met by the present invention wherein a method offorming a barrier layer on a semiconductor device is disclosed.According to one embodiment of the present invention, a semiconductordevice is provided. A silicon-containing material is deposited on thesemiconductor device. The silicon-containing material is processed in areactive ambient.

[0007] According to another embodiment of the present invention, asemiconductor device is disclosed. The semiconductor device includes asubstrate, a gate oxide, a silicon-containing barrier layer and a gateelectrode. The gate oxide is formed over the substrate. Thesilicon-containing barrier layer is formed over the gate oxide. The gateelectrode is formed over the silicon-containing barrier layer.

[0008] Other methods and devices are disclosed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0009] The following detailed description of the present invention canbe best understood when read in conjunction with the accompanyingdrawings, where like structure is indicated with like referencenumerals.

[0010]FIG. 1A illustrates a semiconductor device using a barrier layeraccording to one embodiment of the present invention.

[0011]FIG. 1B illustrates a transistor semiconductor device utilizing abarrier layer according to one embodiment of the present invention.

[0012]FIG. 2A is a flowchart of a method for fabricating a barrier layeraccording to another embodiment of the present invention.

[0013]FIG. 2B illustrates exemplary thickness measurements of thebarrier layer using the method of FIG. 2A.

[0014]FIG. 3 illustrates capacitance characteristics of a semiconductordevice utilizing a barrier layer according to another embodiment of thepresent invention.

[0015]FIG. 4 illustrates a barrier layer according to another embodimentof the present invention.

[0016]FIG. 5 is an illustration of a computer system for use withembodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0017]FIG. 1A illustrates a semiconductor device 108 using a barrierlayer 102 according to one embodiment of the present invention. Thesemiconductor device 108 is merely illustrated schematically in FIG. 1and is typically fabricated proximate to a substrate 101. Morespecifically, the semiconductor device 108 may be formed in, on or overthe substrate 101. For the purposes of defining and describing thepresent invention, it is noted that a semiconductor device 108 maycomprise a transistor, capacitor, electrode, insulator or any of avariety of components commonly utilized in semiconductor structures. Thesubstrate 101 may comprise one or more semiconductor layers orsemiconductor structures which may define portions of the semiconductordevice 108. The barrier layer 102 is formed over the semiconductordevice 108. Generally, the barrier layer 102 is formed by depositing oneor more precursor materials from a silane or silazane source andconverting the deposited materials into the barrier layer 102 bysubsequent processing of the deposited materials. The subsequentprocessing of the deposited materials involves subjecting the depositedmaterials to a reactive agent, such as an oxidizing or nitridizingspecies, which will react with silicon in the deposited materials. Thebarrier layer 102 reduces or prevents diffusion or migration of dopantsinto and out of the semiconductor device 108 and reaction or oxidationof the materials forming the semiconductor device 108.

[0018]FIG. 1B illustrates a transistor semiconductor device 109utilizing a barrier layer 102 according to another embodiment of thepresent invention. A source 105 is formed in a substrate 101. A drain106 is formed in the substrate 101. A gate oxide layer 104 is formedover the substrate 101 from the source 105 to the drain 106. A barrierlayer 102 is formed over the gate oxide layer 104. An electrode or gateelectrode 103 is formed over the barrier layer 102. The source 105, thedrain 106, the substrate 101, the gate oxide layer 104 and the gateelectrode 103 may be provided in accordance with convention techniquesof semiconductor fabrication.

[0019] The barrier layer 102 is fabricated by vapor depositing one ormore selected materials or precursors from a silicon source andsubsequently processing those materials or precursors. The siliconsource may be a silazane or a silane source such as hexamethyldisilazane(HMDS). Other silicon sources which may be used aretetramethyldisilazane, octamethylcyclotetrasilazine,hexamethylcyclotrisilazine, diethylaminotrimethylsilane ordimethylaminotrimethylsilane. The selected material is processed in areactive ambient to create a final desirable silicon-containing barrierlayer. Reactive ambients include oxygenating or nitridating specieswhich will react with silicon to form the silicon-containing barrierlayer. Some reactive ambients are NH₃, N₂, O₂, O₃, NO and the like. Theresulting silicon-containing barrier layer is the barrier layer 102 andmay comprise a layer that is primarily nitride, primarily oxide or anoxynitride depending on the reactive ambient selected.

[0020] The barrier layer 102 prevents dopants, such as boron, in thegate electrode 103 from diffusing into the gate oxide layer 104, thesource 105 and the drain 106. The barrier layer 102 also preventsreactions between the gate electrode 103 and the gate oxide layer 104,prevents migration of dopants from the gate electrode 103 to other areasof the semiconductor device, prevents oxidation of the gate electrode103 and prevents the formation of silicides on the gate electrode.

[0021]FIG. 2A illustrates a method for fabricating a barrier layeraccording to one embodiment of the present invention. A wafer orsubstrate is provided at block 201. The wafer or substrate is cleanedusing hydrofluoric acid (HF) at block 202. A silicon-containing materialis vapor deposited onto the surface of the wafer at block 203 from asilicon source. The silicon-containing material is treated or processedusing rapid thermal nitridation (RTN) in an NH3 ambient at block 204resulting in creation of the barrier layer. The temperature, anneal timeand processing pressure are selected to obtain desired barrier layercharacteristics. A wet oxidation layer is formed over the barrier layerat block 205.

[0022]FIG. 2B illustrates thickness measurements of the barrier layerand wet oxidation layer created using the method of FIG. 2A usingvarious processing conditions. In this figure, the wet oxidation has athickness of 300 Å. For this particular example, FIG. 2B illustratesthat a suitable barrier layer may be formed at about 450 Torr and 850°C., over a processing time of 60 seconds with minimal oxidation of theunderlying silicon substrate. It is noted that the 850° C. processingtemperature is lower than the processing temperature (typically 95° C.)used to create barrier layers using conventional methods. In addition,the 60 seconds processing time is lower that the processing time used tocreate barrier layers using conventional methods (typically 45 minutes).However, the processing time can be longer without a detrimental affectif silane or silazane silicon sources are used because they are selflimiting.

[0023] Generally, conventional barrier layers are processed usingtemperature ranges of 700° C. to 1050° C., processing time of 10 secondsto 60 minutes, and processing pressure of 760 torr. Whereas, the barrierlayer of the present invention is typically processed using temperatureranges of 500° C. to 900° C., processing time of 30 seconds to 5minutes, and processing pressure of 450 torr. It is contemplated thatvariations to these ranges may also result in suitable barrier layerformation.

[0024] Referring to FIGS. 1B and 3, FIG. 3 illustrates the capacitancecharacteristics of a semiconductor device 109 utilizing a barrier layer102 according to the present invention. The capacitance characteristicsof a device with a conventional barrier layer with a N+PH₃ dopedpolysilicon gate electrode are illustrated at 301. Line 302 illustratesthe capacitance characteristics of a device with a conventional barrierlayer and a BF₂ doped polysilicon gate electrode. Line 303 shows thecapacitance characteristics of a barrier layer 102 created by vapordepositing HMDS with a N+PH₃ doped polysilicon gate electrode 103. Line304 shows the capacitance characteristics of a device with a barrierlayer 102 created by vapor depositing HMDS with a BF₂ doped polysilicongate electrode. Comparing the capacitance values of lines 301 and 302with lines 303 and 304, it is noted that negative bias capacitance isenhanced by the present invention. The barrier layers used in lines 303and 304 were processed using NH₃ and O₂.

[0025] In addition, line 302 shows how the conventional barrier layersuffers boron diffusion into the gate and active areas (note the shiftin threshold voltage at 306). Line 307 shows that the measured workfunction, associated with the vapor deposited HMDS barrier layers oflines 303 and 304 match theoretical values.

[0026]FIG. 4 illustrates use of a barrier layer 402 according to anotherembodiment of the present invention. The barrier layer 402 is locatedbetween a dielectric 403 and a electrode 401. The barrier layer 402 iscreated by depositing a silicon-containing material (from silazane orsilane type silicon sources). The layer is then post-processed in areactive ambient. The dielectric 403 is of a material susceptible tooxygen migration such as Ta₂O₅. The electrode is of a material such asP—Si, SiGe, a metal, or any other electrode material suitable for use insemiconductor based charge storage devices.

[0027]FIG. 5 is an illustration of a computer system 512 that can useand be used with embodiments of the present invention As will beappreciated by those skilled in the art, the computer system 512 wouldinclude ROM 514, mass memory 516, peripheral devices 518, and I/Odevices 520 in communication with a microprocessor 522 via a data bus524 or another suitable data communication path. The mass memory 516 caninclude silicon-containing barrier layers in, for example, transistorstructures or charge storage structures. These devices can be fabricatedaccording with the various embodiments of the present invention.

[0028] For the purposes of describing and defining the presentinvention, formation of a material “on” a substrate or layer refers toformation in contact with a surface of the substrate or layer. Formation“over” a substrate or layer refers to formation either above or incontact with a surface of the substrate.

[0029] As stated earlier, barrier layers fabricated using the presentinvention can be used for a variety of purposes. Some examples follow,but embodiments of the present invention are not limited to these. Abarrier layer can be formed on top of metals to prevent oxidation ofmetals. A barrier layer can be placed between metals and siliconcontaining materials to prevent agglomeration, the formation ofsilicides. A barrier layer can be used in a P+ or N+ gate to preventdopant, hydrogen, or flourine in-diffusion into the gate dielectricreducing defect density and increasing performance and reliability. Abarrier layer can be used in post gate stack and pre oxidation steps toprevent oxygen in-diffusion into active areas of the transistor.

[0030] A barrier layer can be used to prevent oxidation of gateelectrodes with subsequent processing steps when using materials such aspolysilicon, Si—Ge, W or other transistion metals. A barrier layer canbe used with a storage dielectric, such as non-volatile random accessmemory, and may be used to reduce degradation of tunnel oxideperformance.

[0031] Having described the present invention in detail and by referenceto preferred embodiments thereof, it will be apparent that modificationsand variations are possible without departing from the scope of thepresent invention defined in the appended claims.

What is claimed is:
 1. A method of forming a barrier layer on asemiconductor device comprising: providing a substrate including atleast one semiconductor layer; fabricating the semiconductor deviceproximate to the substrate; depositing a silicon-containing materialfrom a silicon source over at least a portion of the semiconductordevice; and processing the silicon-containing material with a reactiveagent selected to react with silicon atoms of the silicon-containingmaterial to form the barrier layer.
 2. The method of claim 1, whereinthe silicon source is a silazane.
 3. The method of claim 1, wherein thesilicon source is selected from the group comprisinghexamethyldisilazane, tetramethyldisilazane,octamethylcyclotetrasilazine, hexamethylcyclotrisilazine,diethylaminotrimethylsilane and dimethylaminotrimethylsilane.
 4. Themethod of claim 1, wherein the silicon-containing material is from asilane source.
 5. The method of claim 1, wherein the reactive agent isselected from the group comprising Nh₃, N₂, O₂, O₃, N₂O and NO.
 6. Themethod of claim 1, wherein the barrier layer is primarily nitride. 7.The method of claim 1, wherein the barrier layer is primarily oxide. 8.The method of claim 1, wherein the barrier layer is primarilyoxynitride.
 9. A method of forming a barrier layer comprising: providinga substrate including at least one semiconductor layer; fabricating afirst semiconductor device proximate to the substrate; depositing asilicon-containing material over at least a portion of the firstsemiconductor device; processing the silicon-containing material with areactive agent selected to react with silicon atoms of thesilicon-containing material to form the barrier layer; and fabricating asecond semiconductor device over the barrier layer.
 10. The method ofclaim 9, wherein the reactive agent is NH₃ and the barrier layer isprimarily nitride.
 11. A method of forming a barrier layer comprising:providing a silicon substrate including at least one semiconductorlayer; vapor depositing a silicon-containing material from a silazanesource over at least a portion of the silicon substrate; and processingthe silicon-containing material in a reactive ambient selected to reactwith silicon atoms of the silicon-containing material at a processingtemperature, a processing time and a processing pressure.
 12. The methodof claim 11, wherein vapor depositing a silicon-containing material andprocessing the silicon-containing material are repeated at least once.13. The method of claim 11, wherein the processing temperature is about850° C., the processing time is about 60 seconds and the processingpressure is about 450 Torr.
 14. A method of forming a barrier layer in asemiconductor device including a transistor structure, said transistorstructure including a source, a drain and a gate oxide layer formed overan active area between said source and drain, said method comprising:depositing a silicon-containing material over at least a portion of thetransistor structure; processing the silicon-containing material in areactive ambient to form the barrier layer; and forming a gate electrodeover the barrier layer.
 15. The method of claim 14 further comprising:doping the gate electrode with phosphor.
 16. The method of claim 14further comprising: doping the gate electrode with boron.
 17. The methodof claim 14, wherein processing the silicon-containing material in areactive ambient comprises processing the silicon-containing material inan oxidizing agent causing silicon atoms of the silicon-containingmaterial to bond with oxygen atoms of the oxidizing agent.
 18. A methodof forming a capacitor device with a barrier layer, the methodcomprising: forming an electrode over a substrate; depositing asilicon-containing material over the electrode; processing thesilicon-containing material using rapid thermal nitridation with anitridizing reactant to form the barrier layer; and forming a dielectriclayer over the barrier layer.
 19. A device comprising: a substratehaving at least one semiconductor layer; a semiconductor devicefabricated proximate to the substrate; and a silicon-containing barrierlayer formed over at least a portion of the semiconductor device bysubjecting silicon-containing material in a precursor layer formed overthe portion of the semiconductor device to a reactive agent selected toreact with silicon of the silicon-containing material.
 20. The device ofclaim 19, wherein the silicon-containing barrier layer is oxynitride.21. A semiconductor device comprising: a substrate; a source formed inthe substrate; a drain formed in the substrate; a gate oxide formed overthe substrate; a silicon-containing barrier layer vapor deposited overthe gate oxide and processed in a reactive ambient; and a gate electrodeformed over the silicon-containing barrier layer.
 22. The semiconductordevice of claim 21, wherein the silicon-containing barrier layer isprocessed for at least 60 seconds at a pressure of 450 Torr and at atemperature range of 700° C. to 900° C.
 23. The semiconductor device ofclaim 21 further comprising: a second silicon-containing barrier layervapor deposited over the gate electrode and processed in a reactiveambient.
 24. The semiconductor device of claim 21, wherein the siliconcontaining barrier layer is formed from hexamethyldisilazane.
 25. Thesemiconductor device of claim 21, wherein the reactive ambient is anitridizing agent and the barrier layer is primarily nitride.
 26. Thesemiconductor device of claim 21, wherein the reactive ambient is anoxidizing agent and the barrier layer is primarily oxide.
 27. Asemiconductor device comprising: a substrate having at least onesemiconductor layer; a metal layer formed over the substrate; and asilicon-containing barrier layer formed over the metal layer bydepositing a silicon-containing material over the metal layer andcausing silicon atoms of the silicon-containing material to react with areactant.
 28. A semiconductor device comprising: a substrate having atleast one semiconductor layer; a transistor structure formed proximateto the substrate, the transistor structure having: a source formed inthe substrate; a drain formed in the substrate; and a gate oxide layerformed over the substrate substantially between the source and drain;and a primarily oxide silicon-containing barrier layer formed over thegate oxide layer by reacting silicon atoms of the silicon-containingbarrier layer with a primarily oxidizing reactant.
 29. A semiconductordevice comprising: a substrate having at least one semiconductor layer;a transistor structure formed proximate to the substrate, the transistorstructure having: a source formed in the substrate; a drain formed inthe substrate; and a gate oxide layer formed over the substratesubstantially between the source and drain; and an oxynitride siliconcontaining barrier layer formed over the gate oxide layer by reactingsilicon atoms of the silicon-containing barrier layer with a oxidizingand nitridizing reactant.
 30. A capacitor device comprising: a firstelectrode formed over a substrate; a primarily nitridesilicon-containing barrier layer formed over the electrode; a dielectriclayer formed over the primarily nitride silicon-containing barrierlayer; and a second electrode formed over the dielectric layer.
 31. Acomputer system comprising: at least one processor; a system bus; amemory device coupled to the system bus, the memory device including oneor more memory cells comprising: a substrate; a drain formed in thesubstrate; a source rail formed in the substrate; a first oxide layerdeposited over the substrate stretching from the drain to the sourcerail; a silicon-containing barrier layer deposited over the first oxidelayer; and a gate electrode deposited over the silicon-containingbarrier layer.